ver: 1.1 oct 18, 2012 tel: 886-3-5788833 http://www.gmt.com.tw 1 g1214a global mixed-mode technology rail-to-rail i/o, high-slew-rate op amp features ? +2.2v to +7v single-supply operation ? input / output rail-to-rail ? low input current ? high output driving capacity ? low quiescent current: 500 a @ 5v ? high slew rate 6.5v/ s ? high gain-bandwidth product 6.5mhz ? high open loop gain 95db ? high psrr 70db applications ? headphone driver ? portable equipment ? battery-powered equipment ? multimedia audio ? asic input or output amplifier ? sensor amplifier ? low power/low voltage applications ? set-up box audio hp or pre-driver applications general description g1214a is a input/output rail-to-rail operational ampli- fier. it can be operated from +2.2v to +7v single sup- ply or from 1.1v to 3.5 dual supply. g1214a can drive 66ma into resistor loads to within 10% power rail. ac performance is very excellent with 6.5mhz band- width, 6.5v/ s slew rate, 95db open loop gain, 60 degree phase margin and low distortion. supply current of g1214a is only 500 a per amplifier. it is very suitable for low current consumption applica- tions to control high current loads. applications include audio amplification for computers, sound ports, sound cards and set-top boxes. g1214a is housed in a small sot-23-5 & wdfn1.6x1.6-6 package. ordering information order number marking temp. range package (green) g1214at11u 124ax -40 c to 85 c sot-23-5 g1214au61u 124 ax -40 c to 85 c wdfn1.6x1.6-6 note:t1: sot-23-5 u6: wdfn1.6x1.6-6 1: bonding code u: tape & reel pin configuration typical application circuit rail-to-rail is a registered trademark of nippon motorola, ltd. g1214a sot-23-5 g1214a r l 2k out in + - + vdd 4 in+ 1 3 2 in- out + 5 4 1 3 2 vss + 5 wdfn1.6x1.6-6 1214a nc vss vdd out 1 2 3 6 5 4 thermal pad in+ in- vdd note: recommend connecting the thermal pad to the ground for excellent power dissipation. g1214a sot-23-5 g1214a r l 2k out in + - + vdd 4 in+ 1 3 2 in- out + 5 4 1 3 2 vss + 5 wdfn1.6x1.6-6 1214a nc vss vdd out 1 2 3 6 5 4 thermal pad in+ in- vdd note: recommend connecting the thermal pad to the ground for excellent power dissipation.
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